96% Alumina Ceramic Substrate

其他信息

Standard Thickness

As Fired 96% Al2O3: 0.25-1.5mm Available

Purity of Material

96% Alumina

Forming Method

Tape Casting

Secondary Process

Lapping, Laser Cutting, CNC Machining, etc.

Features

High Mechanical Strength, High Insulation

Application

Packaging of electronic devices, the insulating layer of circuit boards, etc.

Product Introduction

96% alumina ceramic substrate is a common high-purity alumina ceramic substrate with an alumina content of over 96%. Alumina ceramic substrates have excellent physical and chemical properties, so they are widely used in the fields of electronics, communications, optoelectronics, and electric power.

96% alumina ceramic substrate has the following characteristics:

1. High temperature stability: It can maintain stable performance under high temperature environment.

2. High mechanical strength: able to withstand certain external forces and stresses.

3. Good insulation performance: it can be used as the insulating layer of electronic components.

4. Strong corrosion resistance: it can be used stably for a long time in harsh environments.

5. Good dimensional stability: not easy to deform, can meet the requirements of precision assembly.

6. Excellent thermal conductivity: it can be used for heat dissipation of high-power electronic components.

 

 

Material Properties

Alumina Ceramic Substrate
Item Unit 96% Al2O3
Mechanical Properties
Color / / White
Density Drainage Method g/cm3 ≥3.70
Light Reflectivity 400nm/1mm % 94
Flexural Strength Three Point Bending MPa >350
Fracture Toughness Indentation Method MPa·m1/2 3.0
Vickers Hardness Load 4.9N GPa 14
Young’s Modulus Stretching Method GPa 340
Water Absorption  % 0
Camber / Length‰ T≤0.3: ≤5‰, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading) / 1200
CTE (Coefficient ofThermal Expansion) 20-800℃ 1×10-6/℃ 7.8
Thermal Conductivity 25℃ W/m·K >24
Thermal Shock Resistance 800℃ ≥10 Times No Crack
Specific Heat 25℃ J/kg·k 750
Electrical Properties
Dielectric Constant 25℃, 1MHz / 9.4
Dielectric Loss Angle 25℃, 1MHz ×10-4 ≤3
Volume Resistivity 25℃ Ω·cm ≥1014
Dielectric Strength DC KV/mm ≥15

 

 

Product Specification

96% Al2O3 Ceramic Substrate

Thickness(mm) Maximum Size(mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.25 120 114.3 114.3 Tape Casting
0.3 120 114.3 114.3 Tape Casting
0.38 140×190 Tape Casting
0.5 140×190 Tape Casting
0.635 140×190 Tape Casting
0.76 130×140 Tape Casting
0.8 130×140 Tape Casting
0.89 130×140 Tape Casting
1 280×240 Tape Casting
1.5 165×210 Tape Casting
Other special thicknesses within the thickness range of 0.1-1.5mm can be achieved by lapping.

 

Remark:
We not only produce ordinary square and rectangular ceramic substrates, but also round thin ceramic wafers, pink and black ceramic substrates. In addition, we produce aluminum nitride and silicon nitride ceramic substrates.

 

 

Typical Applications

96% alumina ceramic substrates are widely used in the packaging of electronic devices, the insulating layer of circuit boards, high-power LED heat sinks, optoelectronic devices, power electronic devices and other fields. Its high temperature stability, high mechanical strength, and good insulation properties make it an ideal material of choice.

High Heat Dissipation 96% Alumina Substrate in Electrical Ceramics

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