Alumina Ceramic Lid with Gold Plating

其他信息

Specification

Customized

Material

96%, 99.6% Alumina

Surface Metallization Process

Gold Plating

Feature

Good Electrical Conductivity and Solderability

Application

Used as a packaging cover for electronic devices

Transport Package

Vacuum Packaging

Product Introduction

Gold-plated alumina ceramic lid is an alumina ceramic lid with a thin metallized layer of gold. Alumina ceramic substrate is a high temperature ceramic material with good high temperature resistance, corrosion resistance and insulation properties. The metallization layer is to coat a layer of metal material on the surface of the alumina ceramic substrate, usually a metal film, such as metallized copper, silver or gold.

The aluminum oxide metallized ceramic cover has the following advantages after gold plating:

1. Electrical conductivity: Can be reliably electrically connected to the electronic device.

2. Solderability: Can be welded and connected with other electronic components.

3. Protective performance: The metallized layer can provide good protective performance to protect the alumina ceramic substrate and prevent it from being corroded and damaged by the external environment.

 

 

Product Application

Gold-plated alumina ceramic lids are widely used in electronics, communications, military and other fields. It can be used as a packaging cover for electronic devices to provide electrical connection and protection functions; it can also be used as a packaging cover for sensors, capacitors, magnetic components, etc. to provide stable electrical performance and protection functions. This metallized ceramic cover has excellent performance and reliability in high temperature, high pressure, and corrosive environments, so it is widely used and favored.

 

Ceramic Pin Format Package

 

 

Preparation Process of Gold-plated Alumina Ceramic Lids

1. Preparation of alumina ceramic lid: select suitable processes to prepare alumina ceramic sheets of a certain specification.

2. Surface treatment: In order to improve the adhesion between metal and ceramic substrates, it is usually necessary to carry out appropriate treatment on the ceramic surface, such as cleaning, grinding, pickling, etc.

3. Metal Deposition: Deposition of the underlying metal, such as nickel or copper, is performed first. After the deposition of the bottom layer is completed, metal deposition on the surface, such as gold or silver, is carried out. The gold (/silver) metal layer has good conductivity and oxidation resistance.

4. Surface treatment: After gold plating, the metal layer can be polished and cleaned to obtain a better surface finish.

 

 

Why Choose Us

Jinghui is a professional manufacturer of metallized ceramic substrates. It is our goal to provide ideal solutions for customers’ different application requirements. Whether it is cost or engineering solutions, our goal is to find the most economical and suitable solution for our customers!

Send Your Inquiry Today

We will contact you within 1 working day, please pay attention to the email with the suffix “@jinghui0738.com”

Ask For A Quick Quote

We will contact you within 1 working day, please pay attention to the email with the suffix “@jinghui0738.com”