Alumina TPC Substrate for High Power Module

Product Introduction

High-power modules usually require high-performance heat-dissipating substrates to provide excellent heat dissipation and reliability. Alumina TPC (Thick Printing Ceramic) substrate is a heat dissipation substrate commonly used in high-power modules.

Alumina TPC substrate adopts alumina ceramic substrate material, which has excellent heat dissipation performance and electrical insulation. The copper metal layer is prepared on the surface by thick film printing technology, forming a direct heat conduction path with electronic components, which can efficiently conduct heat generated by electronic components. At the same time, the copper metal layer and the aluminum oxide substrate have good electrical insulation performance, which can effectively isolate current and improve the reliability and stability of the circuit.

Due to its excellent heat dissipation performance and reliability, alumina TPC substrates are widely used in high-power module fields, such as electric vehicles, wind power, industrial power supplies, etc. It can effectively reduce the operating temperature of electronic components and improve the performance and life of the entire module. At the same time, the machinability of alumina TPC substrate also provides convenience for circuit design and assembly.

Production Process of TPC Substrates

Thick Printing Ceramic (TPC) Substrate refers to the production process of directly coating the conductive paste on the ceramic substrate by screen printing, and then sintering at high temperature to make the metal layer firmly adhere to the ceramic substrate.

Depending on the viscosity of the metal paste and the mesh size of the screen, the thickness of the metal circuit layer is generally several microns to tens of microns (increasing the thickness of the metal layer can be achieved by multiple screen printing).

Why Choose Us

Jinghui is a professional manufacturer of metallized ceramic substrates. It is our goal to provide ideal solutions for customers’ different application requirements. Whether it is cost or engineering solutions, our goal is to find the most economical and suitable solution for our customers!