DBC Ceramic Substrate for Power Electronics

About DBC Ceramic Substrates

DBC is the abbreviation of Direct Bonded Copper. DBC ceramic substrate is a composite material made by directly bonding copper material with better thermal conductivity and ceramic material with better insulation performance.

DBC ceramic substrate has excellent thermal conductivity and insulation performance, which can effectively conduct and dissipate the heat generated by power electronic equipment, and improve the stability and reliability of the equipment. At the same time, the DBC ceramic substrate also has good dimensional stability and mechanical strength, and can withstand large mechanical stress.

DBC ceramic substrates usually use alumina (Al2O3) or aluminum nitride (AlN) as the base material. They have excellent insulating properties and thermal conductivity, making them ideal for heat dissipation in power electronics.

Comparison of DBC Ceramic Substrates and Other Metallized Ceramic Substrates

The copper foil bonded by DBC technology is generally thicker, 100~600μm, has a strong current carrying capacity, and can meet the application requirements of device packaging in extreme environments such as high temperature and high current. It is a proven standard device in power electronic modules and has obvious advantages in the field of IGBT and LD packaging.

Why Choose Us

Jinghui has advanced surface treatment process of ceramic substrates and has mass production capacity. Our products have been verified by the market for many years, their reliability and stability have been unanimously recognized by customers, and their quality has reached the leading level in the market.