Laser Scribing Aluminum Nitride Ceramic Sheet

Category Bare Ceramic Substrates Tags AlN, Ceramic Substrate

Additional information

Specification	Standard or Customized
Forming Method	Tape Casting
Material	Aluminum Nitride Ceramic
Further Processing	Lapping, Polishing, Laser Scribing, Laser Cutting, etc.
Application	Ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor module circuits and high-power devices.

Introduction of Aluminum Nitride Ceramic Sheets

Aluminum nitride (AlN) is a ceramic material commonly used on bare ceramic substrates. It has two very important properties: high thermal conductivity and a coefficient of thermal expansion (CTE) that matches Si.

1. Aluminum Nitride is the best thermally conductive material available and is used in a variety of applications where heat needs to be conducted away from the component.

2. The low coefficient of thermal expansion makes AlN an ideal material for packaging and submounts of power components such as power LEDs, high-power ICs, and high-voltage inductors.

Comparison of Al2O3 and AlN

Alumina (Al2O3)	Properties	Aluminum Nitride (AlN)
white dense	Appearance	gray dense
0.15-0.3	Surface Roughness (Ra, μm)	0.2-0.7
>24	Thermal Conductivity (20ºC, W/(m·K))	≥170
7.8	CTE (1×10^-6/ºC)	4-6
9.5	Dielectric constant (E)	9
≥17	Dielectric Strength (KV/mm)	≥15

Our Manufacturing Capacity

1. We can produce aluminum nitride ceramic substrates in various standard shapes, and can also perform secondary processing by laser scribing, laser cutting, precision machining, etc. according to customer requirements.

2. Standard thicknesses include 0.2mm, 0.38mm, 0.50mm, 0.635mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm and 3.0mm. Other thicknesses can also be customized if required.

Laser Scribing & Cutting_AIN Ceramic Substrate 5