| Specification | Standard or Customized |
|---|---|
| Forming Method | Tape Casting |
| Material | Aluminum Nitride Ceramic |
| Further Processing | Lapping, Polishing, Laser Scribing, Laser Cutting, etc. |
| Application | Ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor module circuits and high-power devices. |
Aluminum nitride (AlN) is a ceramic material commonly used on bare ceramic substrates. It has two very important properties: high thermal conductivity and a coefficient of thermal expansion (CTE) that matches Si.
1. Aluminum Nitride is the best thermally conductive material available and is used in a variety of applications where heat needs to be conducted away from the component.
2. The low coefficient of thermal expansion makes AlN an ideal material for packaging and submounts of power components such as power LEDs, high-power ICs, and high-voltage inductors.
| Alumina (Al2O3) | Properties | Aluminum Nitride (AlN) |
| white dense | Appearance | gray dense |
| 0.15-0.3 | Surface Roughness (Ra, μm) | 0.2-0.7 |
| >24 | Thermal Conductivity (20ºC, W/(m·K)) | ≥170 |
| 7.8 | CTE (1×10-6/ºC) | 4-6 |
| 9.5 | Dielectric constant (E) | 9 |
| ≥17 | Dielectric Strength (KV/mm) | ≥15 |
1. We can produce aluminum nitride ceramic substrates in various standard shapes, and can also perform secondary processing by laser scribing, laser cutting, precision machining, etc. according to customer requirements.
2. Standard thicknesses include 0.2mm, 0.38mm, 0.50mm, 0.635mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm and 3.0mm. Other thicknesses can also be customized if required.
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Jinghui Ceramic
We will contact you within 1 working day, please pay attention to the email with the suffix “@jinghui0738.com”.
We will contact you within 1 working day, please pay attention to the email with the suffix “@jinghui0738.com”.
