Machined 96% Aluminum Oxide Round Plate

其他信息

Specification

Customized

Material

96% Alumina

Common application

Hybrid PCB or a heat spreader at the back of a PCB

Features

Excellent heat resistance, high mechanical strength, abrasion resistance, and small dielectric loss

Introduction of Alumina Ceramic Substrates

 

About Thickness

Aluminum Oxide, is also known as alumina (Al2O3). The thicker the alumina ceramic substrate, the better the strength and the stronger the pressure resistance, but the thinner the thermal conductivity is worse. On the contrary, the thinner the substrate, the weaker its strength and pressure resistance, but the stronger its thermal conductivity.

 

About Shape

Most alumina ceramic substrates are single-sided or double-sided. The shape of the substrate is generally rectangular, square or circular. In PCB proofing, according to the requirements of the processing technology, some also need to make grooves or dams on the ceramic substrate.

 

About Size

The size of the alumina ceramic substrate is not as big as possible, mainly because the substrate is made of ceramics, which can easily cause the substrate to break during the PCB proofing process, resulting in a lot of waste.

 

About Molding Technique

Common ceramic substrate forming technologies mainly include dry pressing, isostatic pressing and tape casting.

  • The dry pressing method has high density and good substrate flatness, but low production efficiency and high cost, making it difficult to prepare ultra-thin substrates.
  • The isostatic pressing method has uniform density distribution and low firing shrinkage, but it is difficult to accurately control the size and shape, and the productivity is low.
  • Tape casting is easy to operate, efficient in production, continuous in operation and high in automation. Embryo body density and membrane elasticity are higher. The processing technology is mature. Production specifications are controllable. For these reasons, tape casting is widely used in the production of alumina ceramic substrates.

 

Below is the process flow of our bare ceramic substrates.

 

0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer

 

 

Our Manufacturing Capacity of 96% Alumina Ceramic Substrates

1. Product Specification

We can produce products with various specifications. The table below shows our standard thicknesses and sizes.

96% Alumina Ceramic Substrate

Thickness(mm) Maximum Size(mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.25 120 114.3 114.3 Tape Casting
0.3 120 114.3 114.3 Tape Casting
0.38 140×190 Tape Casting
0.5 140×190 Tape Casting
0.635 140×190 Tape Casting
0.76 130×140 Tape Casting
0.8 130×140 Tape Casting
0.89 130×140 Tape Casting
1 280×240 Tape Casting
1.5 165×210 Tape Casting
Other special thicknesses within the thickness range of 0.1-1.5mm can be achieved by lapping.

 

2. Product Tolerances

96% Alumina Ceramic Substrate
Item Substrate Thickness (mm) Standard Tolerance (mm) Best Tolerance (mm) Laser Cutting Tolerance (mm)
Length and Width Tolerance / ±2 ±0.15
Thickness Tolerance T<0.3 ±0.03 ±0.01
0.30-1.0 ±0.05 ±0.01
T>1.0 ±10% ±0.01

 

Applications

0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer

Why Choose Us

1. We provide personalized customization services. Machining services for products includes lapping, polishing, laser scribing, laser cutting, etc.

2. In order to meet different market requirements, we put our unceasing efforts to promote quality control. You are welcome to contact us for further information.

0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer

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We will contact you within 1 working day, please pay attention to the email with the suffix “@jinghui0738.com”