Electrical Metallized Ceramic Disc Insulator

其他信息

Model NO.

Customized

Customized

94.4%-99.8% Alumina

Color

White, Beige, Pink

Application

Refractory, Structure Ceramic, Industrial Ceramic

Further Finishing Treatment

Machining, Glazing, etc

Surface Metallization Process

Mo-Mn, Enp, Silver Firing, W-Au

Transport Package

Vacuum Packaging

Electrical Metallized Ceramic Disc Insulator

It’s a complex and precision manufacturing process for making metallized ceramics, we’d like to briefly state the process flow chart based on some regular alumina metallized ceramics as below:

Precision Ceramic Alumina Aluminum Oxide Machined Ceramics Al2O3 Structural Components
1. Forming Method

We will choose the most suitable forming method on the basis of saving costs and ensuring quality.

Forming Method Features
Dry Pressing 1. High production efficiency, suitable for mass production.
2. High product density and high mechanical strength.
3. Especially suitable for making ceramic products with flat shapes and small cross-sectional thickness.
4. More mold wear, complex processing and high cost.
Hot Pressing 1. High dimensional accuracy.
2. Less mold wear and relatively low production cost.
3. High production efficiency, suitable for mass production.
4. Especially suitable for making engineering ceramic parts with complex shapes.
5. Low product density, relatively more internal defects and poorer mechanical properties and performance stability.
6. Not suitable for making thick-walled or large-sized ceramic products.
Isostatic Pressing 1. Highest density and uniform distribution, high mechanical strength.
2. Less mold wear and relatively lower cost.
3. Able to make large-scale ceramic products with concave, slender and other complex shapes.
4. Not easy to control the size and shape accurately.
5. Low productivity, not easy to realize automation.
Ceramic Injection Molding
(CIM)
1. High degree of mechanization and automation, suitable for mass production.
2. Uniform density and compactness, high geometric precision and surface finish.
3. Able to make ceramic products with high dimensional accuracy and complex shape.
4. High equipment investment and processing costs.

2. Finishing Process

In order to achieve the precision of the product, most ceramic structural parts need further finishing treatment after the sintering process.

Finishing Process Features
Machining In order to achieve a smoother surface and better finish, as well as to meet the dimensional tolerances required by customers, we can perform machining processes such as lapping and polishing on the ceramic structural parts.
Glazing A glaze coating can achieve an excellent surface finish, minimize dirt and grease build-up to avoid surface leakage and flashovers, and increase the strength and imperviousness of the ceramic surface.

3. Metallization Process

Metallization of ceramics refers to the creation of thin metal layers (films) on the surface of ceramics. After the surface of the ceramic material is metallized, it has both the characteristics of ceramics and the properties of metal.

Common Metallization Process Process Description Advantages Disadvantages
Electroless Nickel Plating Method Ceramic Body + Electroless Ni Plating 1. Uniform coating and small pinholes.
2. Low cost, suitable for mass production.
Low bonding strength
Silver Firing Method Ceramic Body + Ag Coating 1. Silver has strong electrical conductivity and good oxidation resistance.
2. The fired silver layer is firmly bonded, and the thermal stability is good.
3. The process is simple and easy to implement.
1. Thin, discontinuous and uneven film layer.
2. Higher cost.
Mo-Mn Method Ceramic Body + Mo-Mn Metallization + Electroplating or electroless Ni plating 1. The most important one in the metal powder sintering methods.
2.  Mature and stable process, and high bonding strength.
3. To prevent oxidation and improve wettability, after the metallized Mo layer is sintered, a Ni layer can be plated on it.
The film layer is discontinuous, uneven, and rough.
W-Au Method Ceramic Body + W Metallization + Au Plating 1. Tungsten metallization has the advantages of simple formula, and can meet some special requirements, such as alkali metal vapor resistance.
2. The gold layer is highly conductive and protects against oxidation and increased contact resistance.
The film density is not high.

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