Super Thin 0.10 0.20mm Zirconia Substrate

其他信息

Specification

Customized

Material

Zirconia Ceramic

Forming Method

Tape Casting

Usage

Bare Ceramic Circuit Board

Optional Color

White, Yellow, Black, Blue

Customized Service

OEM, ODM, Prototyping, Trial Order Supported

Introduction of Zirconia Ceramic Substrates

Zirconia ceramic substrate has the characteristics of high hardness, high compressive strength, low thermal expansion coefficient, etc., and can operate stably under high temperature and high pressure environment.

Zirconia ceramic substrates have good chemical stability and electrical insulation, and can be widely used in electronics, optoelectronics, thermal electronics and other fields.

In addition, it also has excellent wear resistance and corrosion resistance, can maintain good surface flatness and precision for a long time, and is suitable for various precision machining processes. As an important basic material, zirconia ceramic substrates have broad application prospects in high-tech industries.

 

 

Molding Technique of Zirconia Ceramic Substrates

At present, injection molding, dry pressing and tape casting are usually used to produce zirconia ceramic substrates.

1. Injection molding is only suitable for forming thick substrates with a thickness of more than 1 mm.

2. Dry pressing often results in delamination of the green body due to uneven radial and axial pressure distribution during the forming process.

3. Tape casting is suitable for producing thin ceramic substrates with a thickness of 0.2 mm to 3 mm. It has the advantages of fast production speed, high automation, uniform structure and good product quality.

The molding process used for our zirconia ceramic substrates is tape casting.  Below is the process flow.

Large Size Zro2 PCB Sheet Zirconium Oxide Zirconia Ceramic Substrate

 

Material Properties of Zirconia Ceramic Substrates

Zirconia Ceramic Substrate
Item Unit ZrO2
Mechanical Properties
Color / White
Density g/cm3 ≥6
Water Absorption % 0
Vickers Hardness (Load 4.9N) Gpa 11
Young’s Modulus GPa 200
Flexural Strength Mpa >800
Fracture Toughness MPa·m1/2 5.0
Thermal Properties
Max. Service Temperature (Non-loading) ºC 1000
CTE (Coefficient of Thermal Expansion) (20-800ºC) 1×10-6/℃ 7.8
Thermal Shock Resistance ≥10 Times No Crack
Thermal Conductivity (25ºC) W/(m·K) >3
Specific Heat (25ºC) J/(kg·K) 460
Electrical Properties
Volume Resistivity (25ºC) Ω·cm ≥1013
Dielectric Strength KV/mm ≥10
Dielectric Constant (25ºC, 1MHz ) (E) 33
Dielectric Loss Angle (25ºC, 1MHz ) ×10-4 ≤16

 

 

Why Choose Us

The company has strong processing capabilities. We offer bare ceramic substrates in a variety of raw materials, sizes, shapes and thicknesses. Please contact us today with your specifications.

Large Size Zro2 PCB Sheet Zirconium Oxide Zirconia Ceramic Substrate

Send Your Inquiry Today

We will contact you within 1 working day, please pay attention to the email with the suffix “@jinghui0738.com”

Ask For A Quick Quote

We will contact you within 1 working day, please pay attention to the email with the suffix “@jinghui0738.com”