Thick Film Alumina Ceramic Substrate

Jinghui Ceramic has advanced metallized ceramic substrate production equipment and rich production experience, and can meet customers’ needs with fast delivery and stable quality.

Thick film alumina ceramic substrate is a metallized ceramic substrate that uses thick film technology to form a metal layer (such as copper, silver, gold, etc.) with a thickness usually between 10-100 μm on the surface of the alumina ceramic substrate. Its applications are for the connection and layout of integrated circuits and electronic components. Our thick film alumina ceramic substrates have the following advantages:

1. Excellent insulation performance: Can effectively isolate the interference between circuits, and provide good packaging and protection.

2. High mechanical strength: Can withstand greater force and pressure, and has better anti-vibration and impact resistance.

3. Good thermal conductivity: Can quickly conduct heat and improve the heat dissipation effect of electronic devices.

Introduction to Thick Film Technology

TPC ceramic substrate uses thick film technology. TPC ceramic substrate uses thick film technology. Thick film technology mainly refers to the use of screen printing to transfer materials such as conductor paste, resistor paste or dielectric paste to ceramic substrates. After these materials are fired at high temperatures, they will form a firmly adherent film on the ceramic circuit board.

Product Application

Thick film alumina ceramic substrates are widely used in the electronic field, especially in integrated circuits, power modules, sensors, resistors, capacitors and other devices. It can provide good electrical performance, thermal management and mechanical support, meet the layout and connection requirements of complex circuits, and also improve the overall working stability and reliability.