JINGHUI CERAMIC

Zirconia Zro2 Ceramic Round Plate

Additional information

Specification

Customized

Material

Zirconia Ceramic

Color

White, Yellow, Black, Blue

Thickness

From 0.2mm to 3mm Available

Application

Refractory, Structure Ceramic, Industrial Ceramic

Features

Good insulation performance and high temperature stability

Specification of Zirconia Ceramic Round Plates

We produce a selection of ceramic wafers in different materials with customized designs, including aluminum nitride ceramic substrates, alumina ceramic substrates, zirconia ceramic substrates, silicon nitride ceramic substrate, etc.

Optional material Aluminum Nitride (AlN), Alumina (al2o3), Zirconia (ZrO2), Silicon Nitride (Si3N4)
Color White, black, gray, pink
Typical thickness 0.385mm, 0.50mm, 0.635mm, 1.0mm, 1.2mm, 1.5mm, 2mm and 3mm
Dimensional capability Max. side-length to be 500mm*400mm; Max OD to be 400mm
Tolerance OD can be ± 0.01mm; Thickness can be ± 0.005mm
Surface treatment Lapping, diamond-like polishing, metallization, glazing

 

 

Description of Zirconia Ceramic Round Plates

A zirconia ceramic disc is a round thin sheet made of zirconia. It has many good properties.

First, the zirconia ceramic disc has extremely high hardness and excellent wear resistance, and can withstand high temperature and high pressure environments. Secondly, it has excellent chemical stability and will not be corroded by chemicals such as acids and alkalis. In addition, zirconia ceramic discs also have good insulation properties and low thermal conductivity, and can work stably in high temperature environments.

Zirconia ceramic discs are often used in precision instruments, optical devices, electronic components and other fields because of their good insulation performance and high temperature stability.

 

 

Zirconia Ceramic Substrate Technical Datasheet

Zirconia Ceramic Substrate
Item Unit ZrO2
Mechanical Properties
Color / White
Density g/cm3 ≥6
Water Absorption % 0
Vickers Hardness (Load 4.9N) Gpa 11
Young’s Modulus GPa 200
Flexural Strength Mpa >800
Fracture Toughness MPa·m1/2 5.0
Thermal Properties
Max. Service Temperature (Non-loading) ºC 1000
CTE (Coefficient of Thermal Expansion) (20-800ºC) 1×10-6/℃ 7.8
Thermal Shock Resistance ≥10 Times No Crack
Thermal Conductivity (25ºC) W/(m·K) >3
Specific Heat (25ºC) J/(kg·K) 460
Electrical Properties
Volume Resistivity (25ºC) Ω·cm ≥1013
Dielectric Strength KV/mm ≥10
Dielectric Constant (25ºC, 1MHz ) (E) 33
Dielectric Loss Angle (25ºC, 1MHz ) ×10-4 ≤16

 

 

Why Choose Us

  • 10+ Years of OEM and ODM manufacturing experience, a trustworthy professional team.
  • Strong R&D, prototype and mass production capabilities, supporting trial orders and mass production.
  • In-house comprehensive manufacturing facilities from raw materials to high-precision processing.
  • Strict quality control system and process, including work instructions such as IQC, IPQC, QA and OQC.
  • Excellent pre-sales, sales and after-sales services, earnestly fulfilling every customer’s order as the top priority.

 

 

Our Partners

High Thermal Conductivity Beryllium Oxide Beo Ceramic Substrate

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